Publication detail

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

SHARANG, S. DLUHOŠ, J. KALASOVÁ, D. DENISYUK, A. VÁŇA, R. ZIKMUND, T. KAISER, J. OBONA, J.

Original Title

In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

Type

conference paper

Language

English

Original Abstract

Latest technology nodes have made finer, more precise physical failure analysis techniques to emerge. Conventional techniques for larger technology nodes are slowly becoming ineffective. In this paper, we discuss effective yet non-invasive technique like micro CT where we get high fidelity images of the Exynos processor and complement it with further analysis using FIB-SEM systems-based preparation techniques like site-specific homogenous delayering, in-situ probing and TEM lamella preparation which enables failure analysis and reverse engineering techniques like nanoprobing and TEM imaging possible.

Keywords

Delayering, Micro CT, TEM, FIB-SEM, Nanoprobing.

Authors

SHARANG, S.; DLUHOŠ, J.; KALASOVÁ, D.; DENISYUK, A.; VÁŇA, R.; ZIKMUND, T.; KAISER, J.; OBONA, J.

Released

2. 7. 2019

ISBN

978-1-7281-3552-6

Book

IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Pages from

1

Pages to

4

Pages count

4

URL

BibTex

@inproceedings{BUT157871,
  author="S. {Sharang} and Jiří {Dluhoš} and Dominika {Kalasová} and Andrey {Denisyuk} and Rostislav {Váňa} and Tomáš {Zikmund} and Jozef {Kaiser} and Jozef Vincenc {Obona}",
  title="In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System",
  booktitle="IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits",
  year="2019",
  pages="1--4",
  isbn="978-1-7281-3552-6",
  url="http://www.ipfa-ieee.org/"
}