Publication detail

Multidisciplinary Matter of Microelectronics Technology Education

Szendiuch,I.

Original Title

Multidisciplinary Matter of Microelectronics Technology Education

English Title

Multidisciplinary Matter of Microelectronics Technology Education

Type

conference paper

Language

en

Original Abstract

This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.

English abstract

This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.

RIV year

2005

Released

25.07.2005

Publisher

Silisian University of Technology

Location

Gliwice

Pages from

468

Pages to

472

Pages count

5

BibTex


@inproceedings{BUT15390,
  author="Ivan {Szendiuch}",
  title="Multidisciplinary Matter of Microelectronics Technology Education",
  annote="This paper summarizes the both theoretical and practical experience gained in the microelectronic technology area during last twenty years. The overview of new microelectronics technology education system kept at Brno University of Technology, Faculty of Electrical Engineering and Communication (BUT, FEEC) in the study program “Microelectronics” is presented. Microelectronics Technology Education with emphasis on Assembly, Interconnection and Packaging is one of the several specializations in this branch. Basic knowledge about construction of electronics instruments and equipments is more and more important for all, because the larger number of people using them more frequently.",
  address="Silisian University of Technology",
  booktitle="Proceedings Intational Conference on Engineering Education",
  chapter="15390",
  institution="Silisian University of Technology",
  journal="International Conference on Engineering Education and Research "Progress Through Partnership"",
  year="2005",
  month="july",
  pages="468",
  publisher="Silisian University of Technology",
  type="conference paper"
}