Publication detail

Solder joint quality evaluation based on heating factor

STARÝ, J. DUŠEK, K.

Original Title

Solder joint quality evaluation based on heating factor

Type

journal article in Web of Science

Language

English

Original Abstract

Purpose – The purpose of this paper is to increase the reliability of manufactured electronics and to reveal reliability significant factors. The experiments were focused especially on the influence of the reflow oven parameters presented by a heating factor. Design/methodology/approach – The shear strength of the surface mount device (SMD) resistors and their joint resistance were analyzed. The resistors were assembled with two Sn/Ag/Cu-based and one Bi-based solder pastes, and the analysis was done for several values of the heating factor and before and after isothermal aging. The measurement of thickness of intermetallic compounds was conducted on the micro-sections of the solder joints. Findings – The shear strength of solder joints based on the Sn/Ag/Cu-based solder alloy started to decline after the heating factor reached the value of 500 s · K, whereas the shear strength of the solder alloy based on the Bi alloy (in the measured range) always increased with an increase in the heating factor. Also, the Bi-based solder joints showed shear strength increase after isothermal aging in contrast to Sn/Ag/Cu-based solder joints, which showed shear strength decrease. Originality/value – The interpretation of the results of such a comprehensive measurement leads to a better understanding of the mutual relation between reliability and other technological parameters such as solder alloy type, surface finish and parameters of the soldering process.

Keywords

Soldering, Reflow soldering, Heating factor, Intermetallic layers, Mechanical resistance, Reliability of solder joints

Authors

STARÝ, J.; DUŠEK, K.

Released

22. 1. 2018

ISBN

0305-6120

Periodical

CIRCUIT WORLD

Year of study

44

Number

1

State

United Kingdom of Great Britain and Northern Ireland

Pages from

1

Pages to

8

Pages count

8

URL

https://www.emerald.com/insight/content/doi/10.1108/CW-10-2017-0059/full/html

BibTex

@article{BUT150637,
  author="Jiří {Starý} and Karel {Dušek}",
  title="Solder joint quality evaluation based on heating factor",
  journal="CIRCUIT WORLD",
  year="2018",
  volume="44",
  number="1",
  pages="1--8",
  doi="10.1108/CW-10-2017-0059",
  issn="0305-6120",
  url="https://www.emerald.com/insight/content/doi/10.1108/CW-10-2017-0059/full/html"
}