Publication detail

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Original Title

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

English Title

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Type

conference paper

Language

en

Original Abstract

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

English abstract

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

RIV year

2005

Released

01.01.2005

Publisher

IMAPS BENELUX

Location

Brugge, Belgium

Pages from

546

Pages to

1095

Pages count

550

BibTex


@inproceedings{BUT14828,
  author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling",
  annote="This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.",
  address="IMAPS BENELUX",
  booktitle="15th European Microelectronics and Packaging Conference & Exhibition",
  chapter="14828",
  institution="IMAPS BENELUX",
  year="2005",
  month="january",
  pages="546",
  publisher="IMAPS BENELUX",
  type="conference paper"
}