Publication detail

Lead Free Solder Material Compatibility and Technological Factors

Jiří Starý, Ivan Szendiuch

Original Title

Lead Free Solder Material Compatibility and Technological Factors

English Title

Lead Free Solder Material Compatibility and Technological Factors

Type

conference paper

Language

en

Original Abstract

This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study

English abstract

This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study

RIV year

2005

Released

01.01.2005

Location

Vienna

ISBN

0-7803-9325-2

Book

Conference Proceedings ISSE 2005

Edition number

první

Pages from

78

Pages to

83

Pages count

6

BibTex


@inproceedings{BUT14428,
  author="Jiří {Starý} and Ivan {Szendiuch}",
  title="Lead Free Solder Material Compatibility and Technological Factors",
  annote="This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study",
  booktitle="Conference Proceedings ISSE 2005",
  chapter="14428",
  year="2005",
  month="january",
  pages="78",
  type="conference paper"
}