Publication detail

The Analysis of Ceramic Resistor Arrays in SMT

NOVOTNÝ, V. VALA, R. ŠANDERA, J.

Original Title

The Analysis of Ceramic Resistor Arrays in SMT

English Title

The Analysis of Ceramic Resistor Arrays in SMT

Type

conference paper

Language

en

Original Abstract

This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.

English abstract

This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.

Keywords

Resistor, Arrays, Solder joint, Reliability, SAC305, ANSYS, Cycling

Released

01.06.2017

ISBN

978-80-214-5496-5

Book

Proceedings of the 23rd Conference STUDENT EEICT 2017

Edition

2017

Edition number

první

Pages from

550

Pages to

554

Pages count

5

BibTex


@inproceedings{BUT139341,
  author="Václav {Novotný} and Radek {Vala} and Josef {Šandera}",
  title="The Analysis of Ceramic Resistor Arrays in SMT",
  annote="This paper is focused on the area of current electrical manufactory in conjunction with possibilities of computer analysis and monitoring physical phenomenas by computing systems. There are also described processes of preparation and manufactory of testing boards for evaluation reliability of solder joints on specific microelectronicc part which has its place in contemporary electronic production and subsequent analysis of physical processes on these boardss under condition of thermal cycling in thermal chamber and their influences on overall reliability of the entire component. For purposes of analysis were chodsen SMD resistor arrays in configuration 8x0603 which were soldered on typical substrate FR-4 by SAC305 solder. These soldered resistor arrays are also modeled in Solidworks and analyzed by ANSYS. The results achieved by experimental measurement are complemented by simulations of models.",
  booktitle="Proceedings of the 23rd Conference STUDENT EEICT 2017",
  chapter="139341",
  edition="2017",
  howpublished="print",
  year="2017",
  month="june",
  pages="550--554",
  type="conference paper"
}