Publication detail

Reflow Soldering in Vapour Phase Systems

SZENDIUCH, I. HURBAN, M.

Original Title

Reflow Soldering in Vapour Phase Systems

Type

conference paper

Language

English

Original Abstract

IMAPS FLASH CONFERENCE 2016 is international conference for young scientist and industry experts in area of microelectronics packaging and interconnection. This area is very important and decisive for design of modrn electronic systems and circuits

Keywords

Reflow soldering, solder alloy, reliability , soldering process

Authors

SZENDIUCH, I.; HURBAN, M.

Released

3. 11. 2016

Publisher

Novpress s.r.o.

Location

Brno

ISBN

978-80-214-5416-3

Book

2nd IMAPS FLASH CONFERENCE 2016

Edition

1

Edition number

1

Pages from

42

Pages to

43

Pages count

96

BibTex

@inproceedings{BUT130743,
  author="Ivan {Szendiuch} and Milan {Hurban}",
  title="Reflow Soldering in Vapour Phase Systems",
  booktitle="2nd IMAPS FLASH CONFERENCE 2016",
  year="2016",
  series="1",
  number="1",
  pages="42--43",
  publisher="Novpress s.r.o.",
  address="Brno",
  isbn="978-80-214-5416-3"
}