Publication detail

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Original Title

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Czech Title

ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS

Language

cs

Original Abstract

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

Czech abstract

This paper deals with rework of BGA components. The first part is focused on defects and errors in a solder joint. The main part chooses two methods for application flux and solders paste. The final part is focused on dipping and dispensing.

BibTex


@inproceedings{BUT127136,
  author="Radek {Vala} and Michal {Toufar}",
  title="ANALYSIS OF APPLICATION FLUX AND SOLDER PASTE ON PCB FOR BGA COMPONENTS",
  annote="This paper deals with rework of BGA components. The first part is focused on defects
and errors in a solder joint. The main part chooses two methods for application flux and solders
paste. The final part is focused on dipping and dispensing.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  booktitle="Proceedings of the 22nd Conference Student EEICT 2016",
  chapter="127136",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  year="2016",
  month="april",
  pages="203--205",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  type="conference paper"
}