Publication detail

Cleaning of Electronic Assemblies - a Modular Approach

SZENDIUCH, I.

Original Title

Cleaning of Electronic Assemblies - a Modular Approach

Type

conference paper

Language

English

Original Abstract

Cleaning process and its importance in electronics is described and studied, one of solutions is modular approach

Keywords

Cleaning, inpurities

Authors

SZENDIUCH, I.

RIV year

2004

Released

16. 6. 2004

Publisher

IMAPS

Location

Praha

ISBN

80-239-2835-X

Book

Proceedings of 3rd European Microelectronics and Packaging

Edition number

první

Pages from

305

Pages to

310

Pages count

6

BibTex

@inproceedings{BUT12643,
  author="Ivan {Szendiuch}",
  title="Cleaning of Electronic Assemblies - a Modular Approach",
  booktitle="Proceedings of 3rd European Microelectronics and Packaging",
  year="2004",
  volume="2004",
  number="první",
  pages="6",
  publisher="IMAPS",
  address="Praha",
  isbn="80-239-2835-X"
}