Publication detail

Innovative Methods for Through Holes Plating

OTÁHAL, A. ŠIMEK, V. CRHA, A. RŮŽIČKA, R. SZENDIUCH, I.

Original Title

Innovative Methods for Through Holes Plating

English Title

Innovative Methods for Through Holes Plating

Type

conference paper

Language

en

Original Abstract

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

English abstract

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Keywords

Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound

Released

18.05.2016

Publisher

University of West Bohemia

Location

Pilsen, Czech Republic

ISBN

978-1-5090-1389-0

Book

2016 39th International Spring Seminar on Electronics Technology (ISSE)

Pages from

48

Pages to

52

Pages count

534

Documents

BibTex


@inproceedings{BUT126050,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods for Through Holes Plating",
  annote="The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.",
  address="University of West Bohemia",
  booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
  chapter="126050",
  doi="10.1109/ISSE.2016.7563159",
  howpublished="online",
  institution="University of West Bohemia",
  year="2016",
  month="may",
  pages="48--52",
  publisher="University of West Bohemia",
  type="conference paper"
}