Publication detail

Optimization of Through-hole Plating Method for Prototyping

OTÁHAL, A. SZENDIUCH, I. ŠIMEK, V. CRHA, A. RŮŽIČKA, R.

Original Title

Optimization of Through-hole Plating Method for Prototyping

Type

conference paper

Language

English

Original Abstract

Article discusses the enhancement methods of plating through holes on printed circuit boards. Novum was the addition of vacuum or/and ultrasound during the activation process before the surface metallization. For the copper plating method was used reverse pulse plating.

Keywords

Through-hole plating, PCB

Authors

OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.

RIV year

2015

Released

15. 10. 2015

ISBN

978-80-214-5270-1

Book

Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter

ISBN

1802-4564

Periodical

ElectroScope - http://www.electroscope.zcu.cz

Year of study

IfC 2015

Number

1_2016

State

Czech Republic

Pages from

54

Pages to

56

Pages count

3

BibTex

@inproceedings{BUT120369,
  author="Alexandr {Otáhal} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch} and Václav {Šimek}",
  title="Optimization of Through-hole Plating Method for Prototyping",
  booktitle="Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter",
  year="2015",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="IfC 2015",
  number="1_2016",
  pages="54--56",
  isbn="978-80-214-5270-1",
  issn="1802-4564"
}