Publication detail

Innovative procedures for the evaluation method of the efficiency in the cleaning process

BURŠÍK, M. JANKOVSKÝ, J. ŘEZNÍČEK, M. SZENDIUCH, I. SITKO, V.

Original Title

Innovative procedures for the evaluation method of the efficiency in the cleaning process

English Title

Innovative procedures for the evaluation method of the efficiency in the cleaning process

Type

conference paper

Language

en

Original Abstract

High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.

English abstract

High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.

Keywords

Cleaning process, microelectronics, environment, high-quality cleaning

RIV year

2015

Released

06.05.2015

Publisher

IEEE

Location

Eger, Hungary

ISBN

978-963-313-177-0

Book

Electronics Technology (ISSE), 2015 38th International Spring Seminar

Pages from

288

Pages to

291

Pages count

5

URL

BibTex


@inproceedings{BUT120002,
  author="Martin {Buršík} and Michal {Řezníček} and Jaroslav {Jankovský} and Ivan {Szendiuch}",
  title="Innovative procedures for the evaluation method of the efficiency in the cleaning process",
  annote="High-quality electronic assemblies, especially with “Fine Pitch” components, frequently need an effective but nonetheless environmentally friendly cleaning process. This paper deals with the development of an evaluation method of cleaning processes in microelectronics assembly technology. The elaboration of optimum parameters of the cleaning process for individual applications and the cleaning process efficiency as well as an innovative methodology based on the use of patented test substrates is in detail described in this paper.",
  address="IEEE",
  booktitle="Electronics Technology (ISSE), 2015 38th International Spring Seminar",
  chapter="120002",
  doi="10.1109/ISSE.2015.7248007",
  howpublished="print",
  institution="IEEE",
  year="2015",
  month="may",
  pages="288--291",
  publisher="IEEE",
  type="conference paper"
}