Publication detail

MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

OTÁHAL, A. SZENDIUCH, I. ŠEFARA, P.

Original Title

MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

Type

conference proceedings

Language

English

Original Abstract

Solderability depends on many variable factors. The main factors here are the surface finish of PCB and component terminals, the type of flux and solder alloy, the temperature profile and the surrounding atmosphere during the soldering process. This article focuses on the study of the influence of ambient and atmosphere during the soldering process. It is known that one of the main reasons of poor solderability is the presence of oxygen. Reduced oxygen concentration can increase wetability of melted solder [1], activity of the flux, etc., which results the improvement of the reliability [2], [3]. Nitrogen is common used for establishing of inert atmosphere in the soldering process. Mechanical behavior of solder joint is also changed. Paper [4] describe better mechanical parameters achieved by soldering in inert atmosphere, for example higher shear forces of SMDs. The main aim of this work was investigation of mechanical properties of solder joint soldered under nitrogen atmosphere.

Keywords

Nitrogen atmosphere, reflow soldering, shear force

Authors

OTÁHAL, A.; SZENDIUCH, I.; ŠEFARA, P.

Released

15. 10. 2015

ISBN

978-80-214-5270-1

Book

Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter

Pages from

45

Pages to

46

Pages count

2

BibTex

@proceedings{BUT119998,
  editor="Alexandr {Otáhal} and Ivan {Szendiuch} and Petr {Šefara}",
  title="MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE
",
  year="2015",
  pages="45--46",
  isbn="978-80-214-5270-1"
}