Publication detail

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

BOCCACCINI, D. ŠEVEČEK, O. et al.

Original Title

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

English Title

Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces

Type

journal article in Web of Science

Language

en

Original Abstract

The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.

English abstract

The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.

Keywords

Schwickerath crack-initiation test; three-point bending test; SOC interfaces; metal-ceramic bond strength

Released

01.01.2016

Publisher

Elsevier

Location

Holandsko

Pages from

250

Pages to

253

Pages count

4

URL

Documents

BibTex


@article{BUT116748,
  author="D. N. {Boccaccini} and Oldřich {Ševeček}",
  title="Investigation of the bonding strength and bonding mechanisms of SOFCs interconnector-electrode interfaces",
  annote="The determination of the bonding strength (BS) between solid oxide cell (SOC) electrodes and metal interconnects (IC) is of importance since it can impact the SOC lifetime. There are several methods for determining the adhesion between ceramic and metal layers at the macro-scale level, but no standard technique for such measurement is available. In this work, the BSs between an anode support (AS) and three different cathodes with a SOC interconnect were tested in three point bending test configuration. An adaptation of the Schwickerath crack initiation test (SCIT) (ISO 9693) was used to verify its applicability for the determination of bonding strength in the interfaces. The results suggest that this test is a valid method for the mechanical characterization of SOC interfaces.",
  address="Elsevier",
  chapter="116748",
  doi="10.1016/j.matlet.2015.07.137",
  howpublished="online",
  institution="Elsevier",
  number="162",
  volume="2015",
  year="2016",
  month="january",
  pages="250--253",
  publisher="Elsevier",
  type="journal article in Web of Science"
}