Publication detail

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

RIHÁK, P.

Original Title

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

English Title

DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY

Type

conference paper

Language

en

Original Abstract

The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.

English abstract

The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.

Keywords

DPS, BGA, defect, X-ray, detection

RIV year

2015

Released

23.04.2015

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Location

Brno

ISBN

978-80-214-5148-3

Book

Proceedings of the 21st Conference STUDENT EEICT 2015

Edition number

1

Pages from

391

Pages to

395

Pages count

5

BibTex


@inproceedings{BUT114356,
  author="Pavel {Řihák}",
  title="DETECTION OF DEFECT ON FBGA SOLDER BALLS USING X-RAY TECHNOLOGY",
  annote="The paper deals with the detection of defects using X-ray technology. It is focused on a particular type of X-ray machine, which is used for most of these experiments. X-ray cabinet is commonly used for analyzes of defects, which are formed during soldering process. Paper also includes an introduction of different types of defects. These defects are serious issue and they can cause malfunction of infected components or of the entire device. That is the main reason it is so important to focus on this issue.",
  address="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  booktitle="Proceedings of the 21st Conference STUDENT EEICT 2015",
  chapter="114356",
  howpublished="electronic, physical medium",
  institution="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  year="2015",
  month="april",
  pages="391--395",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  type="conference paper"
}