Publication detail

Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure

BULVA, J.

Original Title

Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure

Type

conference paper

Language

English

Original Abstract

This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96% Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changed.

Key words in English

solder joint quality, thermomechanical modelling

Authors

BULVA, J.

RIV year

2004

Released

1. 1. 2004

Publisher

Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno

Location

Brno

ISBN

80-214-2636-5

Book

Proceedings of the 10th Conference Student EEICT 2004

Pages from

560

Pages to

1123

Pages count

564

BibTex

@inproceedings{BUT10965,
  author="Jindřich {Bulva}",
  title="Influence of Solder Joint Height to Internal Stress in Multisubstrate Structure",
  booktitle="Proceedings of the 10th Conference Student EEICT 2004",
  year="2004",
  pages="564",
  publisher="Ing. Zdeněk Novotný, CSc. Ondráčkova 105, Brno",
  address="Brno",
  isbn="80-214-2636-5"
}