Publication detail

Bonding of LTCC with Alumina ceramics

SOMER, J. ŠTEKOVIČ, M. ŠANDERA, J. SZENDIUCH, I.

Original Title

Bonding of LTCC with Alumina ceramics

Type

conference paper

Language

English

Original Abstract

Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the Heraeus zero-shrink LTCC substrates is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for employing in heating elements or packaging. This paper is focused on description of reliable bonding technique of zero-shrink LTCC and alumina ceramics. Testing structure contains Thick Film pattern for verifying compatibility of the bonding process. For bonding of the substrates were used two methods: Cold Chemical Lamination (CCL) and Thermo-compression method employing dielectric thick film paste as adhesive. Optical method and electric testing of the screen-printed patterns verifies bonding quality.

Keywords

Alumina Ceramics, Bonding, LTCC, Cold Chemical Lamination

Authors

SOMER, J.; ŠTEKOVIČ, M.; ŠANDERA, J.; SZENDIUCH, I.

RIV year

2014

Released

25. 6. 2014

Publisher

Vysoké učení technické v Brně

Location

Brno

ISBN

978-80-214-4985-5

Book

Electronic Devices and Systems, IMAPS CS International Conference 2014

Pages from

60

Pages to

64

Pages count

149

BibTex

@inproceedings{BUT108122,
  author="Jakub {Somer} and Michal {Štekovič} and Josef {Šandera} and Ivan {Szendiuch}",
  title="Bonding of LTCC with Alumina ceramics",
  booktitle="Electronic Devices and Systems, IMAPS CS International Conference 2014",
  year="2014",
  pages="60--64",
  publisher="Vysoké učení technické v Brně",
  address="Brno",
  isbn="978-80-214-4985-5"
}