Publication detail

Connection of electronic and microelectronic modules

Original Title

Connection of electronic and microelectronic modules

Czech Title

Connection of electronic and microelectronic modules

Language

cs

Original Abstract

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Czech abstract

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

BibTex


@article{BUT107696,
  author="Josef {Šandera}",
  title="Connection of electronic and microelectronic modules",
  annote="The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.",
  address="Emerald Group",
  chapter="107696",
  doi="10.1108/MI-10-2013-0053",
  institution="Emerald Group",
  number="2",
  volume="31",
  year="2014",
  month="may",
  pages="86--89",
  publisher="Emerald Group",
  type="journal article in Web of Science"
}