Publication detail

Connection of electronic and microelectronic modules

ŠANDERA, J.

Original Title

Connection of electronic and microelectronic modules

English Title

Connection of electronic and microelectronic modules

Type

journal article in Web of Science

Language

Czech

Original Abstract

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

English abstract

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Keywords

Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection

Key words in English

Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection

Authors

ŠANDERA, J.

RIV year

2014

Released

27. 5. 2014

Publisher

Emerald Group

Location

England

ISBN

1356-5362

Periodical

MICROELECTRONICS INTERNATIONAL

Year of study

31

Number

2

State

United Kingdom of Great Britain and Northern Ireland

Pages from

86

Pages to

89

Pages count

4

BibTex

@article{BUT107696,
  author="Josef {Šandera}",
  title="Connection of electronic and microelectronic modules",
  journal="MICROELECTRONICS INTERNATIONAL",
  year="2014",
  volume="31",
  number="2",
  pages="86--89",
  doi="10.1108/MI-10-2013-0053",
  issn="1356-5362"
}