Publication detail

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

ŠANDERA, J. NICÁK, M.

Original Title

Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation

Type

journal article in Web of Science

Language

English

Original Abstract

This article discusses the construction of a system for temperature cycling, where Peltier elements are used as heating or cooling elements. Thisarticle describes the results and experiences based on several years of practice in the area of thermo-mechanical reliability of soldered joints on printed boards with SMD components.

Keywords

Peltier element, thermal cycling, solder joint reliability

Authors

ŠANDERA, J.; NICÁK, M.

RIV year

2014

Released

21. 3. 2014

Publisher

Emerald Group

Location

England

ISBN

0954-0911

Periodical

SOLDERING & SURFACE MOUNT TECHNOLOGY

Year of study

26

Number

2

State

United Kingdom of Great Britain and Northern Ireland

Pages from

53

Pages to

61

Pages count

8

URL

http://dx.doi.org/10.1108/SSMT-02-2013-0004

BibTex

@article{BUT106346,
  author="Josef {Šandera} and Michal {Nicák}",
  title="Temperature Cycling with Peltier Elements of Boards with SMD Components and Failure Evaluation",
  journal="SOLDERING & SURFACE MOUNT TECHNOLOGY",
  year="2014",
  volume="26",
  number="2",
  pages="53--61",
  doi="10.1108/SSMT-02-2013-0004",
  issn="0954-0911",
  url="http://dx.doi.org/10.1108/SSMT-02-2013-0004"
}