Publication detail

Coupled Thermal-Structural Transient Analysis of Pressure Sensors

VLACH, R.

Original Title

Coupled Thermal-Structural Transient Analysis of Pressure Sensors

Type

conference paper

Language

English

Original Abstract

This paper describes computational simulation of coupled analysis of pressure sensors during passage through the furnace. This analysis should show residual stress that is the problem for the next operation as pressure sensor. The software ANSYS/Workbanch was used for coupled thermal-stress analyses. The goal of the project is determination if the residual stress cause by temperature rise in the furnace has a significant impact on pressure sensor accuracy.

Keywords

thermal stress analysis, senzors

Authors

VLACH, R.

RIV year

2013

Released

7. 10. 2013

ISBN

978-3-319-02293-2

Book

Mechatronics 2013

Pages from

495

Pages to

501

Pages count

7

BibTex

@inproceedings{BUT104973,
  author="Radek {Vlach}",
  title="Coupled Thermal-Structural Transient Analysis of Pressure Sensors",
  booktitle="Mechatronics 2013",
  year="2013",
  pages="495--501",
  isbn="978-3-319-02293-2"
}