Publication detail

Investigation of the Mechanical Properties of Lead-Free Solder Materials

OTÁHAL, A. ADÁMEK, M. JANSA, V. SZENDIUCH, I.

Original Title

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Type

journal article - other

Language

English

Original Abstract

Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, actually created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties by lead-free solder joints. There are investigated various properties of common lead free solder paste depending on various concentrations of O2 by reflow process. Next, there are shown microstructures by micro sections for various concentrations of O2. Mechanical properties (mechanical strength) are tested by shear test equipment DAGE 2400.

Keywords

Soldering, lead-free solder paste, nitrogen atmosphere, shear test.

Authors

OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I.

RIV year

2013

Released

15. 11. 2013

Publisher

Trans Tech Publications

Location

Switzerland

ISBN

1662-9795

Periodical

Key Engineering Materials (web)

Year of study

2013

Number

592-593

State

Swiss Confederation

Pages from

453

Pages to

456

Pages count

4

URL

http://www.scientific.net/KEM.592-593.453

BibTex

@article{BUT104280,
  author="Alexandr {Otáhal} and Martin {Adámek} and Vojtěch {Jansa} and Ivan {Szendiuch}",
  title="Investigation of the Mechanical Properties of Lead-Free Solder Materials",
  journal="Key Engineering Materials (web)",
  year="2013",
  volume="2013",
  number="592-593",
  pages="453--456",
  doi="10.4028/www.scientific.net/KEM.592-593.453",
  issn="1662-9795",
  url="http://www.scientific.net/KEM.592-593.453"
}